Komkrisd Wongtimnoi

We don’t have enough information about this author to calculate their statistics. If you think this is an error let us know.
Learn More
In this study, Quad Flat No-lead (QFN) cavity package based on LCP and the reliability impact of the package geometry are investigated. A well-established model of Sn96.5Ag3Cu0.5 solder joint fatigue based on the Darveaux's methodology leading to strain energy density estimation is used. A dedicated Design of Experiments (DoE) is performed to assess the(More)
  • 1