Klaus-Jürgen Wolter

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In this paper, we present a bidirectional interruption-free multimode waveguide coupler for optical bus systems on board and module level. The principle is based on directional core–core coupling and allows for adjustable coupling powers by tuning the overlap area. By adding a bending to one of the coupling partners, it is possible to obtain specific(More)
This paper describes an ultra-thin, low cost 3D glass sensor packaging platform for near-hermeticity with novel feedthrough and encapsulation technologies. Glass panels of thicknesses ranging from 50 µm to 300 µm are used which limits overall form factor to 10 MPa) and Dow Chemical's Benzocyclobutene (BCB) 14-P005 is found to be the best candidate(More)
This paper describes advances in integrated ultra-thin wireless power module components for Internet of Things (IoT) and wireless sensor applications. A typical wireless module integrates both an inductive link for wireless power transfer, and supercapacitor as a storage element. The performance of the inductive link is enhanced with innovative(More)
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