Katsuya Kikuchi

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We evaluated low-impedance power distribution network (PDN) of decoupling capacitor embedded interposers for 3-D integrated LSI system. Measurements are carried out using the developed impedance(More)
Polymer low-k materials have been considered in literature to meet the requirements of lowering the dielectric constant of the dielectric layer to decrease the problem of signal delay, lower power(More)
In this paper, the integration accuracy of conventional flipchip bonding is effectively enhanced by means of automatically maintaining the alignment between the chip and substrate during the time(More)