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  • Kimihiro Yamanaka, Kaoru Kobayashi, Katsura Hayashi, Masahiro Fukui
  • Engineering
  • IEEE Transactions on Components and Packaging…
  • 1 June 2010
  • Flip-chip bonding on organic sequential buildup substrate technology has been an essential part of semiconductor packaging. In the quest for an ever higher semiconductor performance, there has been aContinue Reading