Kaspar M. B. Jansen

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In the electronics industry epoxy molding compounds, underfills and adhesives are used for the packaging of electronic components. These materials are applied in liquid form, cured at elevated temperatures and then cooled down to room temperature. During these processing steps residual stresses are built up resulting from both cure and thermal shrinkage. In(More)
In this paper, a fast moisture sensitivity level (MSL) qualification method and a fast moisture characterization method are discussed. The fast moisture characterization uses a stepwise method to obtain more reliable and more material moisture properties. The established relationships for moisture diffusion coefficients and moisture saturation levels with(More)
Available online xxxx a b s t r a c t In this investigation, the accelerated optical degradation of two different commercial Bisphenol-A Poly-carbonate (BPA-PC) grades under elevated temperature stress is studied. The BPA-PC plates are used both in light conversion carriers in LED modules and encapsulants in LED packages. BPA-PC plates are exposed to(More)
In the electronics industry epoxy molding compounds, underfills and adhesives are used for the packaging of electronic components. These materials are applied in liquid form, cured at elevated temperatures and then cooled down to room temperature. During these processing steps residual stresses are built up resulting from both cure and thermal shrinkage.(More)