Karsten Meier

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Here, we present an advanced experimental procedure for determining the properties of a SnAg3.5 solder alloy in the strain range of primary creep under cyclic load and isothermal conditions. The challenge in this experiment is the accurate high-resolution measurement of sample elongation used for a closed-loop control, as well as avoiding the influence of(More)
In order to investigate the time-independent behaviour of solder joints at high strain rates, a test setup was created capable of measuring the force vs. time reaction of small solder joint in shear loading at strain rates between 10 <sup>-1</sup> - 10<sup>4</sup> [1/s]. The paper describes the design of this high strain rate tester. Details providing for(More)
Electronic devices for automotive applications represent a big market today. The number of these devices per car significantly increased within the last years. At the same time the mounting positions of the devices are close to engine, gear or suspension structures and therefore face harsh use conditions. Nevertheless the expected lifetime of these devices(More)
In this work the life time of solder joints of SMD components is studied under vibration loading. This kind of purely mechanical load is one of the main failure causes in automotive electronics. A test vehicle has been designed to enable vibration testing on SMD capacitors (size 0805). The test vehicle is distinguished with a line clamping and stripe shape(More)
This work focuses on the mechanical behaviour of lead free solder alloys under high strain rate conditions. The knowledge about this specific material behaviour and the ability of consideration in finite element modelling are especially important for reliability investigations on mobile communication and entertainment devices. Since the mechanical behaviour(More)
Solder joints are still the main conductor element between electronic components and carrier substrates. The visco-plastic behaviour of the particle strengthened SnAgCu solder alloys depends strongly on its composition. Additionally, the mechanical behaviour is influenced by solder condition after the soldering reflow process. Further influencing factors(More)
In this work we present the results on a reliability study on chip capacitor solder joints. The components were tested under three different loading conditions. First, temperature shock tests were conducted on a set of various chip capacitor components. Tested components were evaluated for the occurred damage and the causing damage mechanisms. Using finite(More)
This paper focuses on the characterization and Finite Element (FE) simulation of thermo-mechanical loads in Through Silicon Vias (TSVs), which emerge due to the annealing process after electro chemical deposition (ECD) of copper. For this purpose a FE-model has been implemented, which calculates the stress state of TSV structures after annealing. To(More)
The influence of the strain rate dependent yield properties of solder is often neglected in the FEM analyses of JEDEC drop tests. In this paper the effect of this material behavior was tested in drop test simulations of productive BGA components, in order to evaluate the resulting stress distribution and levels in the 2<sup>nd</sup> level interconnects. Two(More)
For the last decades, many mechanical measurements on solder alloys were carried out. As a matter of fact, the microstructure of the solder materials is affected by their compositions. In addition, external variables like the reflow cooling rate, solder volume, thermal mass of the package and pad metallization may have an influence. For those reasons the(More)