Karenyu Chen

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Glass interposer is proposed as a superior alternative to organic and silicon-based interposers for 3DIC packaging in the near future. An excellent dielectric material and could be fabricated with large size, the several attractive advantages such as excellent electrical isolation, better RF performance, better feasibility with CTE and most importantly low(More)
The Glass interposer is proposed as a superior alternative to organic and silicon-based interposers for 3D IC (Integrated Circuit) packaging and 2.5D TSV (Through Silicon Vias) package in the near future. The several attractive advantages such as excellent electrical isolation, better RF performance, better feasibility with CTE, could be fabricated with(More)
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