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As industry moves towards many-core chips, networks-on-chip (NoCs) are emerging as the scalable fabric for interconnecting the cores. With power now the first-order design constraint, early-stage estimation of NoC power has become crucially important. ORION [29] was amongst the first NoC power models released, and has since been fairly widely used for(More)
191 according to the simulation results. In order to mitigate the impact two techniques may be used: 1) design optimization such as insert buffers to reduce the increased delay due to intertier connections and 2) insert registers in the path across different tiers. In this paper, we studied the electrical characterization of intertier connections including(More)
In a gate-level monolithic 3D IC (M3D), all the transistors in a single logic gate occupy the same tier, and gates in different tiers are connected using nano-scale monolithic inter-tier vias. This design style has the benefit of the superior power-performance quality offered by flat implementations (unlike block-level M3D), and zero total silicon area(More)
—We survey recent research and practice in the area of chemical–mechanical polishing (CMP) fill synthesis, in terms of both problem formulations and solution approaches. We review the CMP as the planarization technique of choice for multilevel very large-scale integration metallization processes. Post-CMP wafer topography varies according to pattern(More)
Monolithic 3D is an emerging technology that enables integration density which is orders of magnitude higher than that offered by through-silicon-vias (TSV). In this paper we demonstrate that a modified 2D placement technique, coupled with a post-placement partitioning step, is sufficient to produce high quality monolithic 3D placement solutions. We also(More)
Accurate modeling of delay, power, and area of interconnections early in the design phase is crucial for effective system-level optimization. Models presently used in system-level optimizations, such as network-on-chip (NoC) synthesis, are inaccurate in the presence of deep-submicron effects. In this paper, we propose new, highly accurate models for delay(More)
—Three dimensional integrated circuits (3D-ICs) have emerged as a promising solution to continue device scaling. They can be realized using Through Silicon Vias (TSVs), or monolithic integration using Monolithic Inter-tier vias (MIVs), an emerging alternative that provides much higher via densities. In this paper, we provide a framework for floorplanning(More)
The value of guardband reduction is a critical open issue for the semiconductor industry. For example, due to competitive pressure, foundries have started to incent the design of manufacturing-friendly ICs through reduced model guardbands when designers adopt layout restrictions. The industry also continuously weighs the economic viability of relaxing(More)
Over the course of this decade, uniprocessor chips have given way to multi-core chips which have become the primary building blocks of today's computer systems. The presence of multiple cores on a chip shifts the focus from computation to communication as a key bottleneck to achieving performance improvements. As industry moves towards many-core chips,(More)
In this paper, we present a comprehensive study on the impact of power delivery network (PDN) on full-chip wirelength, routability, power, and thermal effects in monolithic 3D ICs. Our studies first show that the full PDN worsens routing congestion more severely in monolithic 3D ICs than in 2D designs due to the significant reduction in resources for 3D(More)