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Reliable chronic operation of implantable medical devices such as the Utah Electrode Array (UEA) for neural interface requires elimination of transcutaneous wire connections for signal processing, powering and communication of the device. A wireless power source that allows integration with the UEA is therefore necessary. While (rechargeable) micro(More)
MEMS oscillators have recently successfully entered the timing market owing to the packaging revolution enabled by wafer scale technologies. This paper explores how XTAL resonators could similarly benefit from such technologies with the demonstration of a miniature generic timing module. Over the past several years, the decades long quartz-dominated timing(More)
A BiCMOS embedded RF-MEMS switch module is demonstrated. The module consists of four main blocks: 1) RF-MEMS switch technology, 2) Switch models for design-kit implementation, 3) High Voltage (HV) generation and digital interface, 4) Flexible packaging. The RF-MEMS switch technology is detailed by focusing on the contact model, especially in the down-state.(More)
In this paper we demonstrate the modeling and optimization of BiCMOS embedded high aspect ratio through-silicon vias (TSV) for RF-grounding applications. The inductance and the resistance of the TSV are analyzed with respect to TSV design parameters and process effects such as sidewall-tilting and void formation. RF measurement results with extracted(More)
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