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Development and characterization of monolithic, flip-chip compatible 2×50 Gb/s twin-IQ DQPSK MZ modulator chips - capable for hybrid assembly onto planar optical boards of advanced Tbit-capacity… (More)
This paper reports on the first development, fabrication, and characterization of monolithic InP-based twin-IQ Mach-Zehnder modulator chips as basic building blocks for future high capacity and large… (More)
High speed InP-based travelling wave electrode (TWE) Mach-Zehnder modulators are presented and their integration capabilities to fabricate next generations of compact and high capacity transmitter… (More)
The ICT-APACHE research project is focusing on the development of cost-effective, compact, scalable and agile integrated components capable of generating, regenerating and receiving multi-level… (More)
The state-of-the art of medium and large scale InP-based Mach-Zehnder modulator PIC development is reported with regard to commercial fabrication of advanced transmitter components.