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Micrometer-sized Ag particles adsorb substantial oxygen above 200 °C. A dispersion of these particles in alcohol can be successfully used as a die-attach material by sintering the Ag particles to form a soft porous bonding layer. Since the low- temperature sintering of micrometer-sized Ag particles is unlikely to involve the nanometer size effect(More)
This paper investigates the mechanical and electrical properties of anisotropic conductive film (ACF) interconnects between flexible printed circuits (FPC) and glass substrates prepared under a variety of bonding conditions. The curing behavior of the ACF was analyzed by the time-temperature-superposition (TTS) method. TTS analysis using the superposition(More)
An ultra heat-shock resistant die-attach structure for a silicon carbide power device was developed. A silicon carbide die with a gold/titanium nitride coating was soldered with pure zinc onto a DBC with a silicon nitride insulator plate. This die-attach structure could resist severe thermal shock in air temperatures between -50°C and 300°C.(More)
We successfully developed a new Ag nanoparticle paste which can sinter at room temperature simply by drying solvent of the paste. Very small amount of alkylamine was incorporated into the Ag nanoparticles paste to protect the nanoparticles. By drying at room temperature, Ag nanoparticles are sintered resulting in low resistivity of 4.9times10<sup>-6</sup>(More)
Micrometer-sized Ag particles adsorb substantial oxygen above 200&#x00B0;C and a dispersion of these particles in alcohol can be successfully used as a die-attach material by sintering to form a soft porous bonding layer. The characteristics of a light-emitting diode (LED) using this Ag paste as a die-attach material were evaluated. The LED was assembled on(More)
Recently, the authors developed a novel room-temperature wiring method using Ag nanoparticle paste. In this paper, the sintering mechanism of the Ag nanoparticle paste was clarified through examination of the adsorption stability and the removal of the dispersant from the Ag nanoparticles. The Ag nanoparticles in the paste are protected by dodecylamine as a(More)
Controlling solidification behavior becomes one of the key factors because the formation of solidification defects must be prevented in order to accomplish stable and reliable assembling. It is expected that the addition of some solidification nuclei for Sn-Ag-Cu solder can refine the solidification microstructure and suppress undercooling. In this study,(More)