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The long-term reliability of flip chip and boardlevel solder joint is significantly affected by the properties of the surface finish. Various surface finishes such as Immersion Sn, Immersion Ag, Organic solderability preservatives (OSP), Electrolytic Ni/Au (ENEG), and electroless Ni/immersion Au (ENIG) surface finish have been widely used on based Cu pads(More)
The personal electronics market is experiencing rapid growth where smaller electronics carrying more functionality is required. Increasingly, small electronic devices are expected to be incorporated into personal accessories and clothing to make them wearable. This raises great challenges to the substrate technology and related assembly technologies in(More)
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