K. M. B. Jansen

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Moulding compounds are used as encapsulation materials for electronic components. Their task is to protect the components from mechanical shocks and environmental effects such as moisture. Moulding compounds are epoxy resins filled with inorganic (silica) particles, carbon black and processing aids. They show a clear viscoelastic behaviour which is not only(More)
Reliability calculations of the microelectronic packages require cure dependent viscoelastic constitutive relationship for the packaging polymers in order to predict residual stress and strain fields in the final product. The residual stresses can result in the product failure due to warpage, interfacial delamination, thermal fatigue etc. The previous work(More)
Curing effects and difference in thermal contraction of components cause residual stresses and warpage during encapsulation of electronic packages. Residual stresses combined with thermal and mechanical loads influence package reliability and performance and may eventually lead to product failure. Comprehensive material characterisation is needed in order(More)
Numerical simulation plays an important role in product design. Its accuracy relays on a detailed description of geometry, material models, load and boundary conditions. This paper focuses on a new approach of FEM material modeling of three commercially available molding compounds. Curing shrinkage, modulus of elasticity and coefficient of thermal expansion(More)
We have investigated the behaviour of moisture absorption in various humidity environments at constant temperature of two types of epoxy novolac polymers. In addition, we examined the effects of moisture on the viscoelastic properties. The water absorption is carried out in an adjustable thermal and humidity chamber at different temperature and humidity.(More)
The accurate prediction of warpage induced during manufacturing processes is important for the optimal design of both package structure and process conditions. In this paper, a cure-dependent viscoelastic constitutive model is established to model the cure-induced warpage after the map-mould manufacturing process. In the model, the relaxation moduli of the(More)
In this study, two highly filled molding compounds were used as example to demonstrate the characterization scheme. In addition, two low filled packaging polymers are included for comparison. The characterization scheme consists of the steps sample preparation, measurement of the material data, and modeling the material behavior. The ‘sample(More)
Thermoset resins are well known as materials for high performance applications such as in the microelectronics. Examples are moulding compounds, underfill materials, coatings, adhesives, etc. A problem is however that the curing process induces thermal and reaction shrinkage, which leads to residual stresses and warpage. The polymer behavior is highly time,(More)
The acceptable flexibility for ultra-thin substrate would be reached by embedding the ultra-thin substrate into the flexible polyimide and patterning the poly-silicon or silicon into square segmentations. In this contribution, results of experiments and FE simulations on mechanical reliability issues of poly- and single crystalline silicon on ultra-thin(More)
The rubbery (equilibrium) modulus of thermosetting polymers dominates the mechanical behavior at elevated temperature or at long times. It also plays a major role in the residual stress induced during the curing process. In this paper, ai extensive study on the cure-dependent rubbery moduli of silica spheres filled epoxy resin is carried out both(More)