K. K. Jinka

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Title of Thesis: THERMO-MECHANICAL ANALYSIS OF ENCAPSULATED BALL-WEDGE WIRE BONDS IN MICROELECTRONICS, USING RALEIGH-RITZ MODELING Krishna Kumar Jinka, Master of Science, 2006 Thesis directed By: Professor Abhijit Dasgupta Department of Mechanical Engineering This study addresses encapsulated wire bonds in chip-on-board (CoB) multi chip modules, which(More)
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