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A silicon-on-insulator (SOI) micro-electro-mechanical system (MEMS) accelerometer, complementary Metal oxide semiconductor (CMOS) readout circuit and simultaneous hermetic encapsulation using low temperature Cu-Cu bonding are investigated for 3D heterogeneous integration of MEMS and CMOS. The MEMS accelerometer is fabricated using bulk micromachining(More)
Accurately predicting the required spatial resource for aggregate block assembly in shipyard production is difficult due to the following reasons: 1) lack of optimal block on-jig configuration and 2) the dynamic and stochastic nature of production system. Consequently, managerial objectives are seldom achieved without effective production planning and(More)
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