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Journals and Conferences
Virtual metrology (VM) is a novel technology to predict wafer performance from tool slate variables. Virtual metrology can enable wafer to wafer control without additional real metrology.
Stress-induced voiding (SIV) at a narrow metal line connected to a wide metal plate is investigated for Cu/low-k interconnects. Different from the traditional stress migration failure modes of… (More)
Recently, a Stress Migration (SM) failure mode in the metal line was explored and the failure was found to associate with unstable Cu microstructure in the narrow line and fast surface drift velocity… (More)