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For a computing system to be trusted, it is equally important to verify that the system performs no more and no less functionalities than desired. Traditional testing and verification methods are developed to validate whether the system meets all the requirements. They cannot detect the existence or show the non-existence of the unknown undesired… (More)
In this paper, we describe the formatting guidelines for ACM SIG Proceedings. Traditionally silence in VoIP applications is detected by a VAD algorithm after G.729 compression, both have high computational and energy cost. However, such cost on silence frames will be completely wasted because the detected silence frames will not be sent to receiver. We… (More)
Peak current is one of the important considerations for circuit design and testing in the deep sub-micron technology. In a synchronous finite state machine (FSM), it is observed that the peak current happens at the moment of state transitions and it has a strong correlation with the maximum number of state registers switching in the same direction… (More)
— Dual-V t technology is effective in leakage reduction and has been implemented in industry EDA tools. However, on-chip temperature is regarded as uniformly distributed over the chip, with a pre-assumed value. This assumption does not hold for designs in the deep sub-micron deomain as on-chip temperature variation becomes more and more significant. As a… (More)
Energy efficiency has become an important concern for the design of communication systems, particularly the wireless sensor networks where recharging battery might not be feasible. In this paper, we investigate how error correction coding (ECC) and transmission power level can impact the packet loss rate and transmission energy. We focus our analysis on the… (More)
Chip temperature has become an important constraint for achieving high performance on multi-core processors with the popularity of dynamic thermal management techniques such as throttling that slow down the CPU speed. Meanwhile, the within-die process variation creates large discrepancy of maximum operating frequency and leakage power among different cores… (More)
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