Junior Lin

  • Citations Per Year
Learn More
As die sizes shrink with technology node advances, the area of WLCSP dice is becoming too small to accommodate all of the solder balls required for the dice I/O. One solution to this problem has been Fan Out Wafer Level Packages (FOWLP), which have been in volume production for over three years. However, these are Wafer processes, performed with either(More)
Over ten years ago, Wafer Level Chip Scale Packaging (WLCSP) began with very small packages having solderball counts of 2–6 I/O. Over the years, the I/O count has grown, but the industry perception has always been that WLCSPs are limited to low I/O count applications. Within the last year, there has been a growing demand for WLCSP packages with I/O(More)
This is the very first package made by PCB-like process with die-middle concept in the industry, and is named as die-middle ViB-W. ViB is a BGA package with via to electrically interconnect the chip I/O pads to package. The suffix W means the ViB is fabricated by wet PCB-like process which interprets lower cost when compared with the wafer Fab-like dry(More)
  • 1