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BACKGROUND Pain is one of the most common and distressing symptoms in patients with cancer, with a high prevalence of 90%. Appropriate pain assessment is very important in managing cancer pain. OBJECTIVE The aims of this study were to (1) evaluate patient satisfaction with pain control therapy using a self-reporting pain assessment tool, (2) explore the(More)
Malignant pheochromocytoma/paraganglioma (PCC/PGL) is defined by the presence of metastases at non-chromaffin sites, which makes it difficult to prospectively diagnose malignancy. Here, we performed array CGH (aCGH) and paired gene expression profiling of fresh, frozen PCC/PGL samples (n = 12), including three malignant tumors, to identify genes that(More)
In a virtualized system, virtual machine monitor (VMM) decouples a logical device in guest OS from its physical implementation in host OS. It provides many advantages: timeand space-multiplexing of I/O devices for higher utilization, seamless portability even across heterogeneous systems, and live migration of a running virtual machine (VM) between physical(More)
Recently, various security issues in mobile devices have appeared due to improvement of the performance of mobile devices and the emergence of open mobile platforms. In this paper, we present MyAV, which is an all-round virtual machine monitor, to support various platforms from x86 desktops to ARM embedded platforms by minimizing the processor dependencies.(More)
This paper demonstrates a new substantive finding kinetic property in advertising, defined as direction changes in the paths of moving on-screen ad elements, enhances consumer judgments of product novelty. Across six studies, we first outline an inference-based theory as to why the novelty-enhancing effect of kinetic property manifests – kinetic property(More)
operating temperatures and/or low external pressures. Outgassing effects can be often found in cracks of solid surfaces or in small cavities of MEMS/NEMS structures. Outgassing can create a problem for the wafer-level packaging. Wafer-level packaging is essential for miniaturization and high-level integration in the semiconductor industry. It allows for the(More)