Jun-Xiang Liang

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Conductive ink using copper nanoparticles has attracted much attention in the printed electronics industry because of its low cost and high electrical conductivity. However, the problem of easy oxidation under heat and humidity conditions for copper material limits the wide applications. In this study, antioxidative copper inks were prepared by dispersing(More)
Screen printing of silver pastes remains as the dominant front-side metallization process for solar cells due to its simplicity, low cost and high throughput. However, the cost of silver is too high among the conductive metallic materials. Copper paste is the most promising alternative to silver paste in the future, because the cost of copper nanoparticles(More)
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