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Although 3D integration technologies with through silicon vias (TSVs) have expected to overcome the memory and power wall problems in the future microprocessor design, there is no promising EDA tools to design 3D integrated VLSIs. In addition, effects of 3D integration on microprocessor design have not been discussed well. Under this situation, this paper(More)
We have developed a 3D ultrasound imaging system involving computations for use in medical diagnostic applications [1,2]. This system enables us to observe 3D images of moving objects for each transmission. Therefore, we can acquire a 3D image sequence at a high frame rate. Fig. 1 shows a 3D image reconstructed by our 3D ultrasound imaging system. In the(More)
Three-dimensional stacked integrated circuits (3D-SICs) have been expected to overcome the limitations of conventional two-dimensional (2-D) implemented circuits. Since a stacking strategy affects the performance and the power consumption of 3D-SICs, this paper examines two stacking strategies for designing the 3-D stacked floating-point fused multiplyadd(More)
Conventional two-dimensional (2-D) implementation technologies face certain limitations; to overcome these limitations, three-dimensional (3-D) integration technologies have been developed. There has been a focus on circuit partitioning strategies because they play an important role in exploiting the potential of 3-D stacked circuits. The Middle-Grain(More)