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Although 3D integration technologies with through silicon vias (TSVs) have expected to overcome the memory and power wall problems in the future microprocessor design, there is no promising EDA tools to design 3D integrated VLSIs. In addition, effects of 3D integration on microprocessor design have not been discussed well. Under this situation, this paper(More)
Although 3D integration technologies with through silicon vias (TSVs) have expected to overcome the memory and power wall problems in the future microprocessor design, there is no promising EDA tools to design 3D integrated VLSIs. In addition, effects of 3D integration on microprocessor design have not been discussed well. Under this situation, this paper(More)