Jubee Tada

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Three-dimensional stacked integrated circuits (3D-SICs) have been expected to overcome the limitations of conventional two-dimensional (2-D) implemented circuits. Since a stacking strategy affects the performance and the power consumption of 3D-SICs, this paper examines two stacking strategies for designing the 3-D stacked floating-point fused multiplyadd(More)
Conventional two-dimensional (2-D) implementation technologies face certain limitations; to overcome these limitations, three-dimensional (3-D) integration technologies have been developed. There has been a focus on circuit partitioning strategies because they play an important role in exploiting the potential of 3-D stacked circuits. The Middle-Grain(More)