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The capabilities of Horizontal Current Bipolar Transistor (HCBT) technology for radio frequency (RF) integrated circuit (IC) design is analyzed. The HBCT, with its novel technological approach and integration with existing CMOS technologies, is entering the testing phase on IC level. The demanding RF integrated circuit requirements and design issues in the(More)
Two unusual focal accumulations of CJD have been described in the southern and northern parts of Central Slovakia (4, 5). Search for the cause of these foci pointed towards a coincidence of endo-and exogenous risk factors in both areas of high CJD occurrence. While the suspected exogenous risk factor has yet to be definitively identified and confirmed,(More)
A performance of very low-cost 180 nm BiCMOS Horizontal Current Bipolar Transistor (HCBT) technology in wireless communication frequency band is analyzed. A down-converting mixer and divide-by-2 static frequency divider, fabricated using two different HCBT transistors are presented. The higher breakdown-voltage HCBT (3 additional lithography masks) has(More)
Design of cross-coupled voltage controlled oscillator in low-cost HCBT technology is presented. Beside the low-complexity front-end devices, only 2 metal layers are used and the passives are implemented in the available on-chip structures. Varactors are fabricated as pn-junctions by using the ion implantation from the technology. Symmetric inductors are(More)
Emitter length scaling of HCBT with single polysilicon region is investigated by 3D device simulations with the emphasis on the high frequency characteristics. It is shown that collector current and junction capacitances have linear dependence on the emitter length. Collector resistance can be represented by two components which appear in parallel, one that(More)
Double-Emitter Reduced-Surface-Field Horizontal Current Bipolar Transistor is analyzed by the device simulations. Geometrical parameters of the local p-well substrate, which is used to introduce the second drift region are investigated. It is shown that the length of the p-well lpw=0.5 µm is sufficient to obtain efficient electric field shielding and BVCEO(More)
The relative contribution of the hot electrons and hot holes to the reliability degradation of the Horizontal Current Bipolar Transistor (HCBT) is investigated by TCAD simulations. The base current (IB) degradation, obtained by the reverse-bias emitter-base (EB) and mixed-mode stress measurements, is caused by a hot carrier-induced interface trap generation(More)
The impact of the emitter polysilicon etching in Tetramethyl Ammonium Hydroxide (TMAH) on the characteristics of high-linearity mixers fabricated with the low-cost Horizontal Current Bipolar Transistor (HCBT) is analyzed. During emitter formation, the thick layer of α-Si is deposited over the whole wafer, which is then etched-back in the TMAH. The(More)
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