Joseph Fjelstad

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Electronics assembly technology has been wedded to the soldering process for virtually then entire history of electronics manufacturing. The relationship has been a largely successful one predicated on the use of eutectic tin-lead solders which offer a remarkable balance of electrical and mechanical qualities and which can be had using a joining process(More)
This paper presents concepts for assembling electronic products without solder by building circuit layers directly atop the components, obviating the need for solder and its many associated problems. Interconnects are made by copper plating directly to the component terminations. The potential mechanical, electrical, and high-frequency performance benefits(More)
The evolution of the electronics manufacturing industry has followed a path laid down by a series of observation and innovations by physicists that have been made practical by electronic interconnection and packaging engineers. With every new discovery, new solutions to take advantage of them and make them practical arose in response. In this manner the(More)
Electronic assemblies lie at the heart of virtually every aerospace system and mission and have resided there since the earliest days of NASA. Presently electronic assemblies are arguably the most mission-critical aspect of every aerospace mission. Currently and for the past more than half-century traditional organic epoxy resin laminates have served at the(More)
Much has been written about the importance of making "green" electronic products. The EU's RoHS legislation was written in an effort to stem perceived environmental risk from lead in electronic solder and while RoHS ended a non existent problem, it did create a new set of problems for product developers including: greater energy use, the need(More)
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