Jorgen Arendt Jenseny

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Capacitive Micromachined Ultrasonic Transducers (CMUTs) fabricated using Silicon-On-Insulator (SOI) wafers often have large thickness variation of the flexible plate, which causes variation in both pull-in voltage and resonant frequency across the CMUT array. This work presents a bond and boron etch-stop scheme for fabricating the flexible plate of a CMUT.(More)
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