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Microprocessor design has recently encountered many constraints such as power, energy, reliability, and temperature. Among these challenging issues, temperature-related issues have become especially important within the past several years. We summarize recent thermal management techniques for microprocessors, focusing on those that affect or rely on the(More)
Process variation is a challenging problem in 3D microprocessors, since it adversely affects performance, power, and reliability of 3D microprocessors, which in turn results in yield losses. In this paper, we propose a novel architectural scheme that exploits the narrow-width value for yield improvement of last-level caches in 3D microprocessors. In a(More)
Software-based attestation schemes aim at proving the integrity of code and data residing on a platform to a verifying party. However, they do not bind the hardware characteristics to the attestation protocol and are vulnerable to impersonation attacks. We present PUFatt, a new automatable method for linking software-based attestation to intrinsic device(More)
One of the most important hurdles of technology scaling is process variations, i.e., variations in device characteristics. Process variations cause large fluctuations in performance and power consumption in the manufactured chips. In addition, these fluctuations cause reductions in the chip yields. In this work, we present an analysis of a representative(More)
The public reporting burden for this collection of information is estimated to average 1 hour per response, including the time for reviewing instructions, searching existing data sources, gathering and maintaining the data needed, and completing and reviewing the collection of information. Send comments regarding this burden estimate or any other aspect of(More)