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Grain Orientation Evolution and Deformation Behaviors in Pb-Free Solder Interconnects Under Mechanical Stresses
In this study, the effect of mechanical stresses on the recrystallization behavior of Sn-3.0Ag-0.5Cu Pb-free solder interconnects was studied by four-point cyclic bending, shear tests, and tensileExpand
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Nano features of Al/Au ultrasonic bond interface observed by high resolution transmission electron microscopy
Abstract Nano-scale interfacial details of ultrasonic AlSi1 wire wedge bonding to a Au/Ni/Cu pad were investigated using high resolution transmission electron microscopy (HRTEM). The intermetallicExpand
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Ultrasound-assisted brazing of Cu/Al dissimilar metals using a Zn–3Al filler metal
Abstract Ultrasound-assisted brazing of Cu/Al dissimilar metals was performed using a Zn–3Al filler metal. The effects of brazing temperature on the microstructure and mechanical properties of Cu/AlExpand
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Weak attractors and Lyapunov-like functions
Recently Hurley [3] proved that if A is a weak attractor of a discrete dyanamical system f then there exists a Lyapunov-like function for A. The purpose of this note is to study whether the converseExpand
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Growth behavior of Cu6Sn5 grains formed at an Sn3.5Ag/Cu interface
Abstract The growth behavior of Cu6Sn5 grains formed at an Sn3.5Ag/Cu interface was investigated. During soldering, Cu6Sn5 grains formed at the interface, showing a flattened ovoid shape. DuringExpand
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Eddy Current Induced Heating for the Solder Reflow of Area Array Packages
This paper presents a feasibility study of using eddy current induced heating for the solder reflow of area array packages. With a high frequency electromagnetic field, Sn 3.5% Ag lead-free solderExpand
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Cu6Sn5 Morphology Transition and Its Effect on Mechanical Properties of Eutectic Sn-Ag Solder Joints
The morphologies of Cu6Sn5 grains formed at the interface between Sn-3.5Ag (wt.% unless otherwise specified) and Cu substrates were studied in this work. Reflow experiments were performed for 60 s atExpand
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Ultrasound-induced equiaxial flower-like CuZn5/Al composite microstructure formation in Al/Zn–Al/Cu joint
Evolutions of the microstructure and properties of Al/Zn–Al/Cu joints exposed to ultrasonic waves during solidification were investigated. An anisotropic microstructure was exhibited in the jointExpand
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Microstructure and joint properties of ultrasonically brazed Al alloy joints using a Zn-Al hypereutectic filler metal
Abstract The ultrasound-assisted brazing of 1060 Al alloy using a Zn–14Al hypereutectic filler metal was investigated at different temperatures. The effects of brazing temperature on the bondingExpand
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Textured growth of Cu6Sn5 grains formed at a Sn3.5Ag/Cu interface
Abstract The growth orientations of Cu 6 Sn 5 grains formed at a Sn3.5Ag/polycrystalline Cu interface were investigated. Similar as reported on Cu single crystals, strong textures in Cu 6 Sn 5 layersExpand
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