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The chip carrier concept was originally conceived as a square ceramic semiconductor package that could be surface reflow soldered to a ceramic substrate. Its advantages of reduced package size, higher board packing density, lower lead inductance and internal propagation delay, and easy assembly and disassembly were, unfortunately, limited to largely… (More)
A greater percentage of total system cost will be in packaging, making the role of the system packaging engineer crucial for ensuring reasonable system cost.
Packaging technology is poorly taught, poorly funded, and constitutes an area for major technical society concern. So said Rex Rice in his keynote address at the Computer Society Packaging Committee's Spring Workshop, held May 13-15 in Monterey, California.