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3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die stacking is a significant reduction of interconnect both within a die and across dies in a system. For instance, blocks within a microprocessor can be placed vertically on multiple(More)
Critical system designers are turning to off-the-shelf operating system (OS) software to reduce costs and time-to-marker. Unfortunately general-purpose OSes do not always respond to exceptional conditions robustly, either accepting exceptional values without complaint, or suffering abnormal task termination. Even though direct measurement is impractical,(More)
ÐOperating systems form a foundation for robust application software, making it important to understand how effective they are at handling exceptional conditions. The Ballista testing system was used to characterize the handling of exceptional input parameter values for up to 233 POSIX functions and system calls on each of 15 widely used operating system(More)
Software developers identify two main reasons why software systems are not made robust: performance and practicality. This work demonstrates the effectiveness of general techniques to improve robustness that are practical and yield high performance. We present data from treating three systems to improve robustness by a factor of 5 or more, with a measured(More)
When the Ballista project started in 1996 as a 3-year DARPA-funded research project, the original goal was to create a Web-based testing service to identify robustness faults in software running on client computers via the Internet. Previous experience suggested that such tests would find interesting problems but it was unclear how to make robustness(More)
Research and development of new information assurance techniques and technologies is ongoing and varied. Each new proposal and technique arrives with great promise and anticipated success as research teams struggle to develop new and innovative responses to emerging threats. Unfortunately, these techniques frequently fall short of expectation when deployed(More)
Although 3D integrated circuit technology has typically been used to solve specific design goals, it has great potential for protecting intellectual property from theft or unwanted modification while at a third-party fabrication facility. We present analysis of a technique for splitting a design across multiple die layers for this purpose. From the(More)
Robustness is becoming more important as critical software increasingly affects our daily lives. Success in building robust software requires understanding and improving the robustness of the operating system API, but to date there has been no accurate, reproducible way to measure robustness. This paper presents the first full-scale, quantitative(More)