Johannes Fellner

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An approach for determining higher order coefficients of the electrical and thermal conductivities for different materials is presented. The method is based on inverse modeling using three-dimensional transient electrothermal finite element simulations for electrothermal investigations of complex layered structures, for instance polycrystalline silicon(More)
Qualifying a high temperature, high endurance and high reliability integrated EEPROM process module according the JEDEC and AEC standard needs a large number of tested devices. Correlations of various analog and digital measurements must be done at different supply voltages, temperature conditions and with process variations to ensure a stable high yielding(More)
We present an approach for extracting thermal coefficients of higher order for different materials. Based on inverse modeling and using transient electrother-mal simulations thermal investigations of complex lay-ered polycrystalline silicon (Polysilicon) fuses are performed by a three dimensional interconnect simulator. This method is well suited to(More)
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