Joel Silberman

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implementation of the synergistic processor in 65-nm and 90-nm SOI B. Flachs S. Asano S. H. Dhong H. P. Hofstee G. Gervais R. Kim T. Le P. Liu J. Leenstra J. S. Liberty B. Michael H.-J. Oh S. M. Mueller O. Takahashi K. Hirairi A. Kawasumi H. Murakami H. Noro S. Onishi J. Pille J. Silberman S. Yong A. Hatakeyama Y. Watanabe N. Yano D. A. Brokenshire M.(More)
The authors describe the low-power design of the synergistic processor element (SPE) of the cell processor developed by Sony, Toshiba and IBM. CMOS static gates implement most of the logic, and dynamic circuits are used in critical areas. Tight coupling of the instruction set architecture, microarchitecture, and physical implementation achieves a compact,(More)
This 64 b single-issue integer processor, comprised of about one million transistors, is fabricated in a 0.15 /spl mu/m effective channel length, six-metal-layer CMOS technology. Intended as a vehicle to explore circuit, clocking, microarchitecture, and methodology options for high-frequency processors, the processor prototype implements 60 fixed-point(More)
A 6-stage fully pipelined embedded SRAM is implemented in a 90nm SOI technology. The array uses a conventional 6-transistor memory cell and sense amplifier to achieve the cycle time while minimizing the impact of device variation. A sum-addressed pre-decoder allows partial activation for power savings.
3D integration (3DI) holds promise for improved performance of integrated systems by increasing interconnect bandwidth [1]. A processor stacked with cache memory is one potential application of 3DI [2]. This work describes the design and operation of a prototype of a 3D system, constructed by stacking a memory layer, built with eDRAM [3] and logic blocks(More)
This 64 b single-issue PowerPC processor contains 19M transistors and is fabricated in 0.12 /spl mu/m L/sub eff/ six-layer copper interconnect CMOS. Nominal processor clock frequency is 1.0 GHz. At the fast end of the process distribution the processor reaches 1.15 GHz (1.87 V, 101/spl deg/C, 112 W). As in a previous design, nearly the entire processor is(More)
This paper presents a design methodology emphasizing early and quick timing closure for high frequency microprocessor designs. This methodology was used to design a Gigahertz class PowerPC microprocessor with 19 million transistors. Characteristics of “Timing Closure by Design are 1) logic partitioned on timing boundaries, 2) predictable control(More)