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Persistent memory is an emerging technology which allows in-memory persistent data objects to be updated at much higher throughput than when using disks as persistent storage. Previous persistent memory designs use logging or copy-on-write mechanisms to update persistent data, which unfortunately reduces the system performance to roughly half that of a(More)
Processing-in-memory (PIM) is a promising solution to address the "memory wall" challenges for future computer systems. Prior proposed PIM architectures put additional computation logic in or near memory. The emerging metal-oxide resistive random access memory (ReRAM) has showed its potential to be used for main memory. Moreover, with its crossbar array(More)
3-D integration technology is emerging as an attractive alternative to increase the transistor count for future chips. The majority of the existing 3-D integrated circuit (IC) research is focused on the performance, power, density, and heterogeneous integration benefits offered by 3-D integration. All such advantages, however, ultimately have to translate(More)
Processing-in-memory (PIM) provides high bandwidth, massive parallelism, and high energy efficiency by implementing computations in main memory, therefore eliminating the overhead of data movement between CPU and memory. While most of the recent work focused on PIM in DRAM memory with 3D die-stacking technology, we propose to leverage the unique features of(More)
Byte-addressable nonvolatile memories promise a new technology, persistent memory, which incorporates desirable attributes from both traditional main memory (byte-addressability and fast interface) and traditional storage (data persistence). To support data persistence, a persistent memory system requires sophisticated data duplication and ordering control(More)
Emerging byte-addressable nonvolatile memories (NVMs) promise persistent memory, which allows processors to directly access persistent data in main memory. Yet, persistent memory systems need to guarantee a consistent memory state in the event of power loss or a system crash (i.e., crash consistency). To guarantee crash consistency, most prior works rely on(More)
While GPUs are designed to hide memory latency with massive multi-threading, the tremendous demands for memory bandwidth and power consumption constrain the system performance scaling. In this paper, we propose a hybrid graphics memory architecture with different memory technologies (DRAM, STT-RAM, and RRAM), to improve the memory bandwidth and reduce the(More)
In chip-multiprocessor (CMP) designs, limited memory bandwidth is a potential bottleneck of the system performance. New memory technologies, such as spin-torque-transfer memory (STT-RAM), resistive memory (RRAM), and embedded DRAM (eDRAM), are promising on-chip memory solutions for CMPs. In this paper, we propose a bandwidth-aware re-configurable cache(More)
The diminishing momentum of Dennard scaling leads to the ever increasing power density of integrated circuits, and a decreasing portion of transistors on a chip that can be switched on simultaneously---a problem recently discovered and known as <i>dark silicon.</i> There has been innovative work to address the "dark silicon" problem in the fields of(More)
The emerging three-dimensional integrated circuit (3D IC) is beneficial for various applications from both area and performance perspectives. While the general trend in processor design has been shifting from multi-core to many-core, questions such as whether 3D integration should be adopted, and how to choose among various design options must be addressed(More)