A novel E-core hybrid-excited switched-flux permanent-magnet (SFPM) brushless machine is proposed based on an E-core SFPM machine, which has significantly less magnet and higher torque density than… (More)
A novel variable reluctance (VR) resolver with nonoverlapping tooth-coil windings is proposed in this paper. It significantly simplifies the manufacturing process of multilayer windings in… (More)
In order to simplify the manufacturing process of variable reluctance (VR) resolvers for hybrid electric vehicle/electric vehicle (HEV/EV) applications, a novel VR resolver with nonoverlapping… (More)
2006 IEEE International Symposium on Industrial…
2006
Permanent-magnet AC (PMAC) servomotor is finding expanded use in high-performance applications. Because servomotor is always required to instantaneously provide 3 times rated torque, how to protect… (More)
This paper proposes a spoke-type interior permanent magnet (IPM) machine with novel alternate airspace barriers, through which higher torque capability and better manufacturability can be obtained,… (More)
2018 19th International Conference on Electronic…
2018
In this paper, a case in which Bi migration leads to the failure of the chip resistor was analyzed, the source of Bi has been studied, and the analysis process of failure mode and failure mechanism… (More)
When servomotors are made more compact, thermal problem becomes dominant. Nowadays, the combined effect of heatsink and epoxy potting dissipates almost half of the total loss and brings more… (More)
Objective You will learn how to use an alternating current susceptometer to study the magnetiza-tion induced in various magnetic materials in response to the alternating magnetic field inside a… (More)
2018 IEEE International Symposium on the Physical…
2018
Electrochemical migration (ECM) of metal has been studied for decades, including Ag, Ni, Sn, Pb, Cu and Au. These metal materials are commonly used in microelectronics devices, both in package and… (More)
2018 IEEE International Symposium on the Physical…
2018
The chip solder layer of power semiconductor devices carries the mechanical, thermal and electrical loads in the working state of devices. With the increase of packaging density and power density,… (More)