JinSeok Lee

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A new metal-strip-casting process called continuous strip-casting (CSC) has been developed for making thin metal strips. A numerical simulation model to help understand solid-liquid interface behavior during CSC has been developed and used to identify the solidification morphologies of the strips and to determine the optimum processing conditions. In this(More)
A spin-casting process for fabricating polycrystalline silicon sheets for use as solar cell wafers is proposed, and the parameters that control the sheet thickness are investigated. A numerical study of the fluidity of molten silicon indicates that the formation of thin silicon sheets without a mold and via spin casting is feasible. The faster the rotation(More)
Recently, as DRAM device scale is decreasing, multi-patterning and ACL(Amorphous Carbon Layer) process steps are increasing for DRAM manufacturing[1]. This change needs to improve film thickness uniformity to hold a CD(Critical Dimension) uniformity. A showerhead structure is widely adopted in a RF(Radio Frequency) plasma reactor for the thin film(More)
Increasing data needs much larger memory capacity. One of the Flash Memory Solution is Vertical NAND (V-NAND) Flash Memory. In order to fabricate this device, a high aspect ratio hole must be made in the channel hole through the etching process after multilayer thin film deposition. In order to obtain high aspect ratio etch, process condition should have(More)
Silicon sheets were fabricated by a new fabricating method, spin casting with various rotation speeds of the graphite mold. The microstructure of spin-cast silicon sheets were investigated using an electron probe microanalyzer (EPMA) and scanning electron microscope/electron backscatter diffraction/orientation image micrograph, and the lifetime of the(More)
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