Jin-Sang Hwang

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Anisotropic conductive Žlm (ACF) has been used as interconnect material for at-panel display module packages, such as liquid crystal displays (LCDs) in the technologies of tape automated bonding (TAB), chip-on-glass (COG), chipon-Žlm (COF), and chip-on-board (COB). Among them, COF is a relatively new technology after TAB and COG bonding, and its(More)
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