Jimmy Tsang

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The paper introduces an advanced nonconductive film (NCF) typed FC technology employing a novel compliant composite interconnect structure. The interconnect reliability and bondability of the technology are demonstrated through experimental thermal humidity (TH) test in conjunction with a two-point daisy chain resistance measurement. The alternative goal of(More)
Non-Conductive-Film (NCF) type of Chip-on-Glass (COG) bonding method ensures the micro-order direct bonding between the IC electrode and glass substrate electrode. The binding force of the applied adhesive achieves electrical connections between the bumps on the IC chip and the electrodes on the glass substrate. The mathematical calculation results of bump(More)
The electrical characterization of fine-pitch compliant Au bumps is investigated in this study. Compliant Au bumps of 20 microns pitch were fabricated on a glass substrate for chip-on-glass application. Kelvin probes are fabricated and employed to measure the bump resistance. The resistance ranges from 1.0 to 4.5 ohms, depending on process parameters.(More)
International Organising Committee Co-Chairs Phang Siew Moi (Malaysia) Feng (Steven) Chen (Hong Kong) Members Michael A. Borowitzka (Australia) Xiugeng Fei (China) N. Tandeau de Marsac (France) Albert Sasson (France) G. Subramanian (India) A. Vonshak (Israel) T. Matsunaga (Japan) Kazuyuki Miyakawa (Japan) Alan Critchley (Namibia) Lee Yuan Kun (Singapore)(More)
Non-conductive-film (NCF) bonding method ensures the micro-order direct bonding between the IC electrode and circuit substrate electrode. The binding force of the applied adhesive achieves electrical connections between the bumps on the IC chip and the electrodes on the substrate. The stress analysis results are used to identify the appropriate temperature(More)
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