Jie-Hua Zhao

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The ball-on-ring (BOR) and three-point bending (3PB) tests were used in this paper to characterize the effect of the dicing process on the fracture strength of Si dies. Dies prepared by bladeand laser-dicing processes were studied. The edge-initiated fracture was distinguished from the surface-initiated fracture by fractographic analysis. The(More)
Absorption and desorption tests were conducted on five distinct commercial epoxy mold compounds (EMCs) used in electronic packaging. For absorption, the samples were subjected to 85°C /85% relative humidity and 60°C /85% relative humidity soaking. Desorption conditions were above glass transition temperature at 140°C and 160°C. A(More)
Flip-chip plastic ball grid array (FC-PBGA) packages are widely used in high performance components. However, its die back is normally under tensile stress at low temperatures. This paper presents a probabilistic mechanics approach to predict the die failure rate in the FC-PBGA qualification process. The methodology consists of three parts: i) die strength(More)
In this paper, a damage mechanics-based continuum theory is developed to provide a theoretical framework for multi-field problems involving moisture diffusion, heat conduction, moisture evaporation, void growth, and material deformation in a temperature and time-dependent process in encapsulated microelectronics devices. The analysis of moisture diffusion(More)
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