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In this paper, a damage mechanics-based continuum theory is developed to provide a theoretical framework for multi-field problems involving moisture diffusion, heat conduction, moisture evaporation, void growth, and material deformation in a temperature and time-dependent process in encapsulated microelectronics devices. The analysis of moisture diffusion(More)
—The ball-on-ring (BOR) and three-point bending (3PB) tests were used in this paper to characterize the effect of the dicing process on the fracture strength of Si dies. Dies prepared by blade-and laser-dicing processes were studied. The edge-initiated fracture was distinguished from the surface-initiated fracture by fractographic analysis. The(More)
Flip-chip plastic ball grid array (FC-PBGA) packages are widely used in high performance components. However, its die back is normally under tensile stress at low temperatures. This paper presents a probabilistic mechanics approach to predict the die failure rate in the FC-PBGA qualification process. The methodology consists of three parts: i) die strength(More)
Absorption and desorption tests were conducted on five distinct commercial epoxy mold compounds (EMCs) used in electronic packaging. For absorption, the samples were subjected to 85°C /85% relative humidity and 60°C /85% relative humidity soaking. Desorption conditions were above glass transition temperature at 140°C and 160°C. A(More)
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