Jie-Hua Zhao

Learn More
—The ball-on-ring (BOR) and three-point bending (3PB) tests were used in this paper to characterize the effect of the dicing process on the fracture strength of Si dies. Dies prepared by blade-and laser-dicing processes were studied. The edge-initiated fracture was distinguished from the surface-initiated fracture by fractographic analysis. The(More)
Flip-chip plastic ball grid array (FC-PBGA) packages are widely used in high performance components. However, its die back is normally under tensile stress at low temperatures. This paper presents a probabilistic mechanics approach to predict the die failure rate in the FC-PBGA qualification process. The methodology consists of three parts: i) die strength(More)
  • 1