Jie-Fei Zhu

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In order to adapt the harsh service condition of the interconnects between the power semiconductors (chips) and substrates, there is an urgent need to develop alternative interconnect materials.(More)
In this study, core-shell structured SiO2@Ag submicro-sized spheres were prepared and used to improve the performance of the micro-sized silver flakes filled electrically conductive adhesive (ECA).(More)
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