Jicong Zhao

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This paper presents a vacuum encapsulation technique with novel parasitic optimization methods for VHF MEMS resonators. Sn-rich Au-Sn solder bonding is used to achieve reliable hermetic packaging with high shear strength. An equivalent circuit model of the packaged resonator is established to analyze the parasitic effect caused by encapsulation. Reduction(More)
This paper presents a RF MEMS oscillator with high frequency stability and low phase noise. The oscillator consists of MEMS disk resonator and low noise feedback circuits. The two-port radial-contour-mode silicon resonator was fabricated with high Q-factor and hermetically encapsulated using Sn-rich Au-Sn solder bonding, which significantly improves the(More)
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