Jianfei Ni

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A novel ¯ip-chip assembly technique by means of electroplating at a low processing temperature has been developed. Mesoscopic gears, made of nickel with 1500 lm in diameter and 250 lm in height, have been bonded to glass substrate. The bonding process is conducted by nickel electroplating at 50 °C with a current density at 53.3 A/m 2. The nickel electrolyte(More)
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