Jian Wen Mah

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In recent high power LED applications, metal core PCB (MCPCB) has replaced FR4 PCB in order to achieve greater heat dissipation ability. However, the low thermal conductivity of dielectric and other complicated structures in MCPCB has not supported to maintain junction temperature in safe level when LED is operated at higher power. The challenge is to(More)
The effect of thermal impedance of three chip arrangements in a multichip light-emitting diode (LED) package has been discussed with each chip attached to a heat sink with thermal interface material. Each orientation represents different existing lighting applications such as T8 tube, MR 16 down light, and spotlight. In this paper, the emitter and sensor(More)
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