BACKGROUND Transfusion of allogeneic blood influences outcome after surgery. Despite widespread availability of transfusion guidelines, transfusion practices might vary among physicians, departments, hospitals and countries. Our aim was to determine the amount of packed red blood cells (pRBC) and blood products transfused intraoperatively, and to describe… (More)
Microring based silicon depletion modulators with high extinction ratios (>25dB) are used for high frequency modulation and as resonant photodetectors at 1340nm (O-band). Photocurrent and power enhancement are investigated for mircorings with different Q-factors.
Silicon-organic hybrid (SOH) integration combines silicon photonic devices with electro-optic organic cladding materials. We demonstrate that SOH modulators can be used to generate advanced modulation formats with high symbol rates at low operating voltages and low energy consumption. Moreover, we show that the SOH approach can be extended to plasmonic… (More)
We demonstrate a silicon-based 16QAM modulator with a record-low drive voltage of 0.6V<sub>pp</sub> and an energy consumption of 19fJ/bit. The device employs silicon slot waveguides with electro-optic organic cladding and enables data transmission at 112Gbit/s.
In this paper, a model for the analysis and design of a reflective Arrayed Waveguide Grating is presented. The device consists of one half of a regular AWG where each arm waveguide in the array is terminated with a phase shifter and a Sagnac loop reflector. By individually adjusting the phase shifter and Sagnac reflectivity in each arm, additional… (More)
Silicon modulators are maturing and it is anticipated that they are going to substitute state-of-the art modulators. We review current silicon modulator approaches and then discuss the silicon-organic hybrid (SOH) approach in more detail. The SOH approach has recently enabled the operation with an energy consumption of 60 fJ/bit and demonstrated the… (More)
BOOM is a photonic integration concept that aims to develop compact, cost-effective and power efficient silicon photonic components for high capacity routing functionalities. To accomplish this, flip-chip bonding and heterogeneous wafer scale fabrication techniques are employed that enable Si manufacturing with III-IV material processing. We present in this… (More)