Jennifer Stopford

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3D through silicon via (TSV) and vertical stacking technologies have become key enablers in the move towards high density, high functionality 3D integrated circuits. The need to address strain, warpage, delamination, etc. in Systems on Chip or Systems in Package (SoC/SiP) is recognised in the International Technology Roadmap for Semiconductors (IRTS 2009).(More)
The purpose of this article is to offer a reliable and easily formulated alternative to random technique selection or control panel roulette when producing diagnostic radiographs. This system requires only minutes to complete and will reduce the radiation dose to patients, the radiographic film wasted, and the time lost repeating examinations.
Amorphous carbon thin films with a wide range of sp fraction from 20 to 90% grown by filtered cathodic arc deposition have been examined by ultraviolet (UV) at 325 nm and visible Raman spectroscopy at 457 nm excitation wavelength. The comprehensive study of behaviour of G, D and T band with sp/sp content has been carried out. The upwards shift of the G peak(More)
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