Jennifer Kopp

We don’t have enough information about this author to calculate their statistics. If you think this is an error let us know.
Learn More
Edge die yield is becoming critical as semiconductor manufacturing fabs attempt to save costs and reduce wafer edge exclusion to produce more good die per wafer. As a consequence, wafer edge defect inspection and metrology applications are now critical components of the overall yield management strategy in advanced semiconductor fabs. Photolithography is(More)
  • 1