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3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die stacking is a significant reduction of interconnect both within a die and across dies in a system. For instance, blocks within a microprocessor can be placed vertically on multiple(More)
From multiprocessor scale-up to cache sizes to the number of reorder-buffer entries, microarchitects wish to reap the benefits of more computing resources while staying within power and latency bounds. This tension is quite evident in schedulers, which need to be large and single-cycle for maximum performance on out-of-order cores. In this work we present(More)
Bloom Filters are a technique to reduce the effects of conflicts/interference in hash table-like structures. Conventional hash tables store information in a single location which is susceptible to destructive interference through hash conflicts. A Bloom Filter uses multiple hash functions to store information in several locations, and recombines the(More)
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