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Most magnetic nanostructures today are ultrathin or nanostructured films and multilayers. The key challenge for the future will be a suitable technology to integrate and to contact nanostructures in a reliable manner. Real devices are truly 3-dimensional structures, particularly where the roughness and shape of the contact lines influences a performance to(More)
This paper will present a case study on the use of simulation to develop and implement an assembly line for the assembly and test of customer located telephony equipment. The simulation model was used as a tool to assist in development and integration of the assembly and test processes with a focus on capacity, material flow optimization, and equipment(More)
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