Jean-Yves Delétage

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Silicon dice soldered in power assemblies have to withstand simultaneously electrical, thermal and mechanical stress. Mechanical stress is an important issue because it will directly impact on both the device behaviour and power modules reliability. This paper focuses on the electro-mechanical static characterization of a planar gate IGBT by the help of(More)
In this paper, the ageing monitoring of lithium-ion cell during power cycling tests is investigated. First of all, the results of a time-domain characterization method have been used to identify the main factors of ageing. Then, a methodology that takes benefits of a periodic characterization protocol based on impedance spectroscopy measurements is(More)
The thermal behavior of a power transistor mounted on a dissipator is considered in order to estimate the transistor temperature junction using a measure of the dissipator temperature only. The thermal transfers between the electric power applied to the transistor, the junction temperature, and the dissipator temperature are characterized by two fractional(More)
Article history: Received 3 June 2012 Received in revised form 25 June 2012 Accepted 27 June 2012 Available online 16 August 2012 0026-2714/$ see front matter 2012 Elsevier Ltd. A ⇑ Corresponding author. Tel.: +33 (0)5 56 40 28 04 E-mail address: stephane.azzopardi@ims-bordeaux Silver sintering die-attach(More)
Comparing to the most common reliability tests this work presents a new approach of accelerated testing, by combining temperature, humidity and pressure cycling with voltage stress. A design of experiments methodology has been proposed to test IGBT inverters and understand environmental factors effect. The humidity-pressure combination effect is studied for(More)