Jean-Michel Morelle

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This pqper &scribes an overall appmach for the thermal simulation of electronic equipment based on tk cooperation between so@vam dedicated to board design, computadonal @id dy~'cs (CFD) sim&tion and board thermal analysis. Tk board geometrical description, as created by tk CAD system, is shand by the board simulator and tk CFD package, whose role is tk(More)
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