Jean-Michel Guichon

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This paper presents an automatic layout process for power electronics integrated modules. The chip position and power layout is automatically generated according to the best EMC/Thermal trade off. Optimization techniques use simple but fairly accurate EMC and Thermal models, presented in this paper. The proposed method is illustrated on a 4 legs 2kW(More)
Design of integrated power systems requires prototype-less approaches. Accurate simulations are necessary for analysis and verification purposes. Simulation relies on component models and associated parameters. The paper focuses on a step-by-step extraction procedure for the design parameters of a one-dimensional finite-element-method (FEM) model of the PiN(More)
The subject of this paper is related to EMC filter integration. Due to stray interactions between filter components and PCB tracks, or between the components themselves, the transfer function of the filter can be modified. The work will first study these stray interactions and the possible electromagnetic modelling using PEEC method. Then, we aim proposing(More)
 This paper presents an application of an adapted (R-L-M-C) PEEC method dedicated to the extraction of equivalent circuit of power electronics devices. Two dedicated integral methods with different meshes are used to compute either resistive and inductive elements or capacitive couplings. The adaptive multi-level fast multipole method (AMLFMM) is presented(More)
This paper gives generic formulas to account for power components surface in the design of a flyback converter. Starting from the converter requirements, key design parameters are defined, and their influence on converter surface studied. It is shown that some parameters have opposite actions, thus some trade-off must be found. On the other hand, additional(More)
The emergence of new composite materials in the aeronautical domain requires a paradigm shift in the electrical system design, especially concerning the current return path. The composite fuselage cannot comply with the required functionalities, as the aluminium skin does, due to its heating and conductive natural limitations. The aim of this paper is to(More)
Volume integral formulations for solving electromagnetic problems in the frequency domain are proposed. Firstly, it is based on a magnetic flux B and current density J facet interpolation for representing the electromagnetic problem through an equivalent circuit. Secondly, magnetic vector potentials A and electric vector potential T are considered thanks to(More)