Jean Michailos

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3D integration has now made a place in semiconductor landscape and is coming closer from implementation in manufacturing. Although process bricks are almost all available now, there are still several challenges to solve before it is introduced in standard flows. One of those which is not commonly addressed is to get final customer’s interest by showing him(More)
A color image was taken with a CMOS image sensor without any infrared cut-off filter, using red, green and blue metal/dielectric filters arranged in Bayer pattern with 1.75 µm pixel pitch. The three colors were obtained by a thickness variation of only two layers in the 7-layer stack, with a technological process including four photolithography levels. The(More)
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