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We describe an evaluation framework that provides a quantitative measure on the performance of a neural network color constancy model. In this framework, the responses of three models of color constancy to a set of color edges under varying illuminating conditions are computed. We study a model based on double opponent cells, as well as two variants of the… (More)
In this study, 3D IC integrations with a semi-embedded TSV interposer with stress relief gap under thermal operating and environmental conditions are investigated. Emphasis is placed on the determination of the TSV interposer warpage and the nonlinear stress and creep strain in the Al/Cu-low-k pads and micro solder joints.
In this study, 3D IC integrations with a TSV interposer supporting Moore's law chips on its top and bottom sides are investigated. Emphasis is placed on the determination of the TSV interposer warpage and the nonlinear stress and creep strain in the Cu-low-k pads and micro solder joints.